Preparation and Mechanical Property Evaluations of Puncture-Resistant Insoles Composites Reinforced by High-Modulus Filament and Thermal Bonding 


19권  6호, pp. 1309-1317, 6월  2018
10.1007/s12221-018-1116-2


PDF
  통계
2022년 11월부터 누적 집계
동일한 세션일 때 여러 번 접속해도 한 번만 카운트됩니다. 그래프 위에 마우스를 올리면 자세한 수치를 확인하실 수 있습니다.


  논문 참조

[IEEE Style]

T. Li, F. Sun, X. Liu, H. Wu, C. Lou, J. Lin, "Preparation and Mechanical Property Evaluations of Puncture-Resistant Insoles Composites Reinforced by High-Modulus Filament and Thermal Bonding," Fibers and Polymers, vol. 19, no. 6, pp. 1309-1317, 2018. DOI: 10.1007/s12221-018-1116-2.

[ACM Style]

Ting-Ting Li, Fei Sun, Xing Liu, Hua-Ling Wu, Ching-Wen Lou, and Jia-Horng Lin. 2018. Preparation and Mechanical Property Evaluations of Puncture-Resistant Insoles Composites Reinforced by High-Modulus Filament and Thermal Bonding. Fibers and Polymers, 19, 6, (2018), 1309-1317. DOI: 10.1007/s12221-018-1116-2.