Electroless Nickel Metallization on Palladium-free Activated Polyamide Fabric for Electromagnetic Interference Shielding 


Vol. 22,  No. 9, pp. 2433-2439, Sep.  2021
10.1007/s12221-021-0992-z


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  Abstract

In this work, a novel palladium-free and environmentally friendly surface activation process was applied to prepare nickel plated fabric. Firstly, chitosan (CTS) film was formed on the polyamide (PA) surfaces. Then, the electroless nickel plating was carried out on the surface of textile in the absence of Sn through the electroless plating technique. The morphology of nickel-plated PA fabrics was characterized by scanning electron microscope (SEM), energy disperse spectroscopy (EDS) and X-ray diffraction patterns (XRD). The plated nickel fabric exhibited saturation magnetization with coating mass of 331.4 emu/g and good electromagnetic shielding effectiveness (50 dB) in frequency range from 300 KHz to 3000 MHz). This approach reveals a promising potential to fabricate electromagnetic shielding materials, in which nickel salt is as activator instead of metallic palladium to realize the palladium-free activation.

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  Cite this article

[IEEE Style]

E. N. M. o. P. A. P. F. f. E. I. Shielding, "Electroless Nickel Metallization on Palladium-free Activated Polyamide Fabric for Electromagnetic Interference Shielding," Fibers and Polymers, vol. 22, no. 9, pp. 2433-2439, 2021. DOI: 10.1007/s12221-021-0992-z.

[ACM Style]

Electroless Nickel Metallization on Palladium-free Activated Polyamide Fabric for Electromagnetic Interference Shielding. 2021. Electroless Nickel Metallization on Palladium-free Activated Polyamide Fabric for Electromagnetic Interference Shielding. Fibers and Polymers, 22, 9, (2021), 2433-2439. DOI: 10.1007/s12221-021-0992-z.

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