Composite Planks Consisting of High Resilience Buffer Nonwoven Fabrics and Conductive Elastic Polymer Films via Hot Pressing Lamination: Manufacturing Techniques and Mechanical, Buffer, and Electrical Properties 


Vol. 24,  No. 5, pp. 1781-1788, May  2023
10.1007/s12221-023-00053-7


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  Abstract

Polymer-based composites are commonly used in a variety of fields because they offer many advantages. In this study, hot pressing lamination is used to combine high resilience buffer (HRB) nonwoven fabrics and conductive elastic polymer films to form HRBC composite planks. The resulting HRBC composite planks have both buffer effect and electromagnetic shielding effectiveness (EMI SE). Moreover, the carbon nanotubes (CNTs) content of the conductive elastic polymer film is altered in the process. Next, these HRBC composite planks are tested for their mechanical properties, interfacial adhesion level, buffer efficacy, and EMI SE. The test results show that a rise in the CNT content has a positive influence on the mechanical properties. In this case, the tensile strength and puncture resistance are increased by 80% and 24% respectively. Furthermore, the employment of hot pressing lamination does not compromise the functions of constitutional materials. With 10 wt% of CNTs, HRBC composite planks exhibit a 65% higher rebound rate over the polymer side and yield an EMI SE of -47 dB that blocks 99.99% of electromagnetic waves.

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  Cite this article

[IEEE Style]

J. Jhang, H. Kao, J. Lin, C. Lou, "Composite Planks Consisting of High Resilience Buffer Nonwoven Fabrics and Conductive Elastic Polymer Films via Hot Pressing Lamination: Manufacturing Techniques and Mechanical, Buffer, and Electrical Properties," Fibers and Polymers, vol. 24, no. 5, pp. 1781-1788, 2023. DOI: 10.1007/s12221-023-00053-7.

[ACM Style]

Jia‑Ci Jhang, Hsin Kao, Jia‑Horng Lin, and Ching‑Wen Lou. 2023. Composite Planks Consisting of High Resilience Buffer Nonwoven Fabrics and Conductive Elastic Polymer Films via Hot Pressing Lamination: Manufacturing Techniques and Mechanical, Buffer, and Electrical Properties. Fibers and Polymers, 24, 5, (2023), 1781-1788. DOI: 10.1007/s12221-023-00053-7.

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