The Thermal Stability Analysis of Fumes and Mists During the Drying Process of a PCB
Vol. 34, No. 4, pp. 32-40, Aug. 2019

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Cite this article
[IEEE Style]
추창엽, 이정석, 백종배, "The Thermal Stability Analysis of Fumes and Mists During the Drying Process of a PCB," Journal of the Korean Society of Safety, vol. 34, no. 4, pp. 32-40, 2019. DOI: 10.14346/JKOSOS.2019.34.4.32.
[ACM Style]
추창엽, 이정석, and 백종배. 2019. The Thermal Stability Analysis of Fumes and Mists During the Drying Process of a PCB. Journal of the Korean Society of Safety, 34, 4, (2019), 32-40. DOI: 10.14346/JKOSOS.2019.34.4.32.