Evaluation of the Joint Strength of Lead-free Solder Ball Joints at High Strain Rates
Vol. 27, No. 6, pp. 7-13, Dec. 2012
-
dynamic tensile strength lead-free solder joint interface failure modified charpy impact testing machin
Statistics
Cumulative Counts from November, 2022
Multiple requests among the same browser session are counted as one view. If you mouse over a chart, the values of data points will be shown.
Multiple requests among the same browser session are counted as one view. If you mouse over a chart, the values of data points will be shown.
|
|
Cite this article
[IEEE Style]
주세민, 김택영, 임웅, 김호경, "Evaluation of the Joint Strength of Lead-free Solder Ball Joints at High Strain Rates," Journal of the Korean Society of Safety, vol. 27, no. 6, pp. 7-13, 2012. DOI: .
[ACM Style]
주세민, 김택영, 임웅, and 김호경. 2012. Evaluation of the Joint Strength of Lead-free Solder Ball Joints at High Strain Rates. Journal of the Korean Society of Safety, 27, 6, (2012), 7-13. DOI: .