Thermal Decomposition Behavior of Liquid Crystalline Epoxy-Based Composites 


Vol. 55,  No. 5, pp. 324-329, Oct.  2018
10.12772/TSE.2018.55.324


PDF
  Abstract

Thermosetting liquid crystalline epoxy is an epoxy polymer that forms a liquid crystalline network structure upon curing. 4,4'-Diglycidyloxybiphenyl with an aromatic rigid-rod part such as a biphenyl group exhibits liquid crystallinity. Biphenol epoxy resin (BP), which is cured by using sulfanilamide, forms a liquid crystalline network by reacting the amine and epoxy ring of sulfanilamide and biphenol. In this experiment, silicon nitride (Si3N4) or aluminum nitride (AlN) was used as a filler. The activation energy required for the decomposition was calculated using the Kissinger method and the Flynn-wall method to confirm the thermal properties of the thermosetting liquid crystalline epoxy with silicon nitride. As a result, the activation energy required for decomposition of the composite increased with increasing silicon nitride content, and it was confirmed that silicon nitride increased the thermal stability of the thermosetting liquid crystalline epoxy.

  Statistics
Cumulative Counts from November, 2022
Multiple requests among the same browser session are counted as one view. If you mouse over a chart, the values of data points will be shown.


Search
(IN TITLE, AUTHOR, ABSTRACT,KEYWORDS)

Advanced Search ▼

POPULAR KEYWORDS
(TOP 10 KEYWORDS)

Recent Publications
(LAST 3 YEARS)

pISSN : 1225 - 1089
eISSN : 2288 - 6419

한국연구재단 우수등재학술지 유지 (2022년)