열경화성 액정 에폭시 매트릭스 복합재료의 열분해 거동 비교 


55권  5호, pp. 324-329, 10월  2018
10.12772/TSE.2018.55.324


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  요약

Thermosetting liquid crystalline epoxy is an epoxy polymer that forms a liquid crystalline network structure upon curing. 4,4'-Diglycidyloxybiphenyl with an aromatic rigid-rod part such as a biphenyl group exhibits liquid crystallinity. Biphenol epoxy resin (BP), which is cured by using sulfanilamide, forms a liquid crystalline network by reacting the amine and epoxy ring of sulfanilamide and biphenol. In this experiment, silicon nitride (Si3N4) or aluminum nitride (AlN) was used as a filler. The activation energy required for the decomposition was calculated using the Kissinger method and the Flynn-wall method to confirm the thermal properties of the thermosetting liquid crystalline epoxy with silicon nitride. As a result, the activation energy required for decomposition of the composite increased with increasing silicon nitride content, and it was confirmed that silicon nitride increased the thermal stability of the thermosetting liquid crystalline epoxy.

  통계
2022년 11월부터 누적 집계
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pISSN : 1225 - 1089
eISSN : 2288 - 6419

한국연구재단 우수등재학술지 유지 (2022년)