Preparation of Phenolic Films and Analysis of Curing Behavior Through Hot-Melt Bonding Process 


Vol. 55,  No. 5, pp. 365-372, Oct.  2018
10.12772/TSE.2018.55.365


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  Abstract

In this study, highly releasable phenol films were prepared for simplification of the phenolic composite molding process. Thermoplastic polyvinyl butyral (PVB) was added to the phenolic resin to give the phenol film a high releasability by the hot-melt bonding process. The thermal properties of the prepared phenolic film were analyzed with DSC and TGA, and both degree of cure and active energy were calculated using the DSC data. The rheological properties of the film were analyzed using a rheometer, and the tackiness of the film was assessed by the probe tack test according to the heat treatment time. Curing reaction of the phenolic film occurred at a temperature 20oC higher than that of the phenolic resin, and its activation energy was also considerably higher. This can be attributed to the gelation caused by the hydrogen bonding between the PVB and phenolic monomer. Thus, the curing of the film is delayed by gelation.

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pISSN : 1225 - 1089
eISSN : 2288 - 6419

한국연구재단 우수등재학술지 유지 (2022년)