Optimization of Imidization Condition Using Dielectric Analysis
Vol. 56, No. 1, pp. 23-28,
Feb. 2019
10.12772/TSE.2019.56.023
PDF
Abstract
Polyimides (PIs) are polymers that have the basic structure of a rigid aromatic
chain. PIs have excellent thermal and chemical properties, as well as low dielectrical properties.
Therefore, PIs have been widely used in various industrial fields. In general, a PI is
prepared by reacting dianhydride with diamine to prepare a precursor, poly (amic acid)
(PAA), and then imidizing this precursor. The conditions of the imidization reaction have a
large influence on the final properties of the PI; thus, it is very important to optimize the
imidization conditions. In this study, optimal conditions (temperature and time) for imidization
were investigated using dielectric analysis (DEA). To manufacture the PIs, pyromellitic
dianhydride (PMDA) was used as a dianhydride, 4,4'-oxydianiline (ODA), 4,4'-(1,3-phenylenedioxy)-
dianiline (TPE), and bis(trifluoromethyl) benzidine (TFDB/TFMB) as diamines,
and n-methyl-2-pyrrolidone (NMP) as a solvent. The PI film was obtained by drying the PAA
solution at 100oC, and imidizing the PAA film at 200oC and 350oC, respectively. The thermal
decomposition temperature (Td; 5wt%) was measured by thermogravimetric analysis
(TGA) and the mechanical properties, such as tensile strength and elongation at break,
were measured to confirm the effect of imidization conditions on the physical properties of
the PI.
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