Optimization of CMP Filter Layered Structure for Slurry Filtration of Less than 1 Micron 


Vol. 60,  No. 5, pp. 313-320, Oct.  2023
10.12772/TSE.2023.60.313


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  Abstract

The particles contained in the slurry used as an abrasive in the CMP are approximately 1 μm or larger in size, causing micro-scratches on the surface of the wafer during the CMP process. Furthermore, the particles are easily coagulated in the slurry supply line and form large agglomerated particles, which significantly affects the device. Filtration technology is required to remove large particles (1 μm or larger), compounds, or gels in the slurry. Depth filtration is suitable for slurries with high particle concentration and viscosity. The slurry can be filtered through a mechanism that removes particles by trapping them inside the filter while passing through nonlinear paths (tortuosity) in the media layer (thickness of a few mm to tens of mm). Therefore, this study analyzed the filter performance (differential pressure and removal efficiency) by optimizing the number of stacked layers of nanofibers (fine pore size) and melt-blown nonwovens (fine diameter) to control the filter pore size; thus, the particles larger than a certain size are selectively captured and removed within the filter structure in the CMP process, and small particles below a certain size (1 μm) pass through the filter for wafer polishing.

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  Cite this article

[IEEE Style]

H. Chae, K. Kim, S. Kim, "Optimization of CMP Filter Layered Structure for Slurry Filtration of Less than 1 Micron," Textile Science and Engineering, vol. 60, no. 5, pp. 313-320, 2023. DOI: 10.12772/TSE.2023.60.313.

[ACM Style]

Hyo-Jung Chae, Kyung-Do Kim, and Sam-Soo Kim. 2023. Optimization of CMP Filter Layered Structure for Slurry Filtration of Less than 1 Micron. Textile Science and Engineering, 60, 5, (2023), 313-320. DOI: 10.12772/TSE.2023.60.313.

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pISSN : 1225 - 1089
eISSN : 2288 - 6419

한국연구재단 우수등재학술지 유지 (2022년)