Investigation on Microscopic Morphological Variation of Epoxy Adhesives by Dissipative Particle Dynamics Simulations 


Vol. 60,  No. 6, pp. 400-407, Dec.  2023
10.12772/TSE.2023.60.400


PDF
  Abstract

Epoxy structural adhesives are widely used in various industries due to their excellent chemical resistance, thermal properties, high electrical insulation performance, increased joint stiffness, and potential for lightweighting in structural components. While the performance of epoxy adhesives is influenced by various factors such as chemical structures and compositions, it is challenging to analyze the structural morphology of epoxy adhesives at the molecular level. Therefore, in this study, we investigated macroscopic structural changes in epoxy adhesive materials based on the changes of components using dissipative particle dynamics (DPD) simulations. By calculating DPD parameters and simulating the degree of affinity interaction between the epoxy components, we represented the morphological characteristics according to their chemical structure. Through DPD simulations, we analyzed the number density, density field distribution, and diffusion coefficient of structure for each epoxy compositions, revealing that 3,3’- diamino diphenyl sulfone (3,3’-DDS) strongly interact with triglycidyl aminophenol (TGAP) and diglycidyl ether of bisphenol A (DGEBA), and polyether sulfone (PES) has repulsive interaction with TGAP, resulting in significant phase separation.

  Statistics
Cumulative Counts from November, 2022
Multiple requests among the same browser session are counted as one view. If you mouse over a chart, the values of data points will be shown.


  Cite this article

[IEEE Style]

이승걸, 최주희, 이승걸, "Investigation on Microscopic Morphological Variation of Epoxy Adhesives by Dissipative Particle Dynamics Simulations," Textile Science and Engineering, vol. 60, no. 6, pp. 400-407, 2023. DOI: 10.12772/TSE.2023.60.400.

[ACM Style]

이승걸, 최주희, and 이승걸. 2023. Investigation on Microscopic Morphological Variation of Epoxy Adhesives by Dissipative Particle Dynamics Simulations. Textile Science and Engineering, 60, 6, (2023), 400-407. DOI: 10.12772/TSE.2023.60.400.