Intrinsic Low-Dielectric Constant and Low-Dielectric Loss Polyimides
Vol. 26, No. 11, pp. 4673-4690,
Nov. 2025
10.1007/s12221-025-01130-9
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Abstract
The rapid evolution of microelectronics and 5G communication technologies has accelerated the push toward higher integration density and device miniaturization in semiconductor and integrated circuit (IC) systems. Hence, ultra-low-dielectric interlayer materials have become increasingly critical due to their vital role in minimizing signal delay, transmission loss, and electromagnetic crosstalk in high-frequency applications. Among the organic dielectrics, aromatic polyimides (PIs) are regarded as high-performance materials due to their outstanding thermal stability (typically > 450 °C), excellent mechanical strength, chemical resistance, and electrical insulation. However, at a high frequency of 10 GHz, conventional PIs typically exhibit dielectric constants (Dk) and dielectric losses (Df) of 3.1–3.5 and 0.008–0.02, respectively, which exceed the threshold (Dk < 2.7, Df < 0.003) required for next-generation ultrafast communication systems. This limitation has spurred intensive research into strategies for intrinsically lowering both the Dk and Df values of PIs. After introducing the fundamental principles governing the dielectric properties of PIs, the present review highlights recent progress in the molecular design of low-dielectric PIs by incorporating various functional groups, including fluorinated moieties, ester and ether linkages, bulky and non-planar substituents, and aliphatic segments. The effects of these structural modifications on the frequency-dependent dielectric responses and physicochemical properties are systematically analyzed, with an emphasis on elucidating the structure–property relationships that govern the permittivity and dissipation factor. This comprehensive and in-depth exploration of low-dielectric PIs is expected to serve as a fundamental theoretical foundation and valuable empirical reference for guiding the future development of high-performance, next-generation dielectric materials.
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Cite this article
[IEEE Style]
J. Kim and K. Nam, "Intrinsic Low-Dielectric Constant and Low-Dielectric Loss Polyimides," Fibers and Polymers, vol. 26, no. 11, pp. 4673-4690, 2025. DOI: 10.1007/s12221-025-01130-9.
[ACM Style]
Jiyoung Kim and Ki-Ho Nam. 2025. Intrinsic Low-Dielectric Constant and Low-Dielectric Loss Polyimides. Fibers and Polymers, 26, 11, (2025), 4673-4690. DOI: 10.1007/s12221-025-01130-9.