The Effect of Etching on Low-stress Mechanical Properties of Polypropylene Fabrics under Helium/Oxygen Atmospheric Pressure Plasma
Vol. 4, No. 4, pp. 145-150, Dec. 2003
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Cite this article
[IEEE Style]
Y. J. Hwang, J. S. An, M. G. McCord, S. W. Park, B. C. Kang, "The Effect of Etching on Low-stress Mechanical Properties of Polypropylene Fabrics under Helium/Oxygen Atmospheric Pressure Plasma," Fibers and Polymers, vol. 4, no. 4, pp. 145-150, 2003. DOI: fipo-2003-4-4-145.
[ACM Style]
Yoon J. Hwang, Jae Sang An, Marian G. McCord, Shin Woong Park, and Bok Choon Kang. 2003. The Effect of Etching on Low-stress Mechanical Properties of Polypropylene Fabrics under Helium/Oxygen Atmospheric Pressure Plasma. Fibers and Polymers, 4, 4, (2003), 145-150. DOI: fipo-2003-4-4-145.