Effect of Processing Conditions on Warpage of Film Insert Molded Parts
Vol. 9, No. 6, pp. 747-747, Dec. 2008
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Cite this article
[IEEE Style]
S. J. Baek, S. Y. Kim, S. H. Lee, J. R. Youn, S. H. Lee, "Effect of Processing Conditions on Warpage of Film Insert Molded Parts," Fibers and Polymers, vol. 9, no. 6, pp. 747-747, 2008. DOI: fipo-2008-9-6-747.
[ACM Style]
Soo Jin Baek, Seong Yun Kim, Seung Hwan Lee, Jae Ryoun Youn, and Sung Hee Lee. 2008. Effect of Processing Conditions on Warpage of Film Insert Molded Parts. Fibers and Polymers, 9, 6, (2008), 747-747. DOI: fipo-2008-9-6-747.