Mold Filling Analysis of an Alignment Structure in Micro Hot Embossing
Vol. 15, No. 6, pp. 1197-1197, Jun. 2014
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Cite this article
[IEEE Style]
J. A. Gomez, G. T. Conner, D. H. Chun, Y. Kim, I. Song, B. H. You, "Mold Filling Analysis of an Alignment Structure in Micro Hot Embossing," Fibers and Polymers, vol. 15, no. 6, pp. 1197-1197, 2014. DOI: fipo-2014-15-6-1197.
[ACM Style]
Juan A. Gomez, Glenn T. Conner, Du Hwan Chun, Yoo-Jae Kim, In-Hyouk Song, and Byoung Hee You. 2014. Mold Filling Analysis of an Alignment Structure in Micro Hot Embossing. Fibers and Polymers, 15, 6, (2014), 1197-1197. DOI: fipo-2014-15-6-1197.