The Thermal Stability Analysis of Fumes and Mists During the Drying Process of a PCB 


Vol. 34,  No. 4, pp. 32-40, Aug.  2019
10.14346/JKOSOS.2019.34.4.32


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  Abstract

During the manufacturing process of a printed circuit board(PCB), fumes and mists are generated as the ink dries on the PCB surface. The generated fumes and mists are deposited in the dryer wall and the exhaust duct. Deposited fumes and mists may present a fire hazard if the dryer temperature control system fails. In this study, the thermal stability of the fumes and mists deposited in the dryer and ducts has been analyzed by experimental methods such as thermo gravimetric analysis (TGA), differential scanning calorimetry (DSC), auto ignition temperature (AIT), and multiple mode calorimetry(MMC). According to the experimental analyses, experimental samples are likely to generate gas at the temperature (180 ~ 240℃) that deviates from the normal operating temperature (150 ~ 156℃). It has been shown that the thermal stability is degraded when the temperature is deviated from the normal operating temperature. In the end, engineering and management safety measures of accidental prevention have been suggested.

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  Cite this article

[IEEE Style]

추창엽, 이정석, 백종배, "The Thermal Stability Analysis of Fumes and Mists During the Drying Process of a PCB," Journal of the Korean Society of Safety, vol. 34, no. 4, pp. 32-40, 2019. DOI: 10.14346/JKOSOS.2019.34.4.32.

[ACM Style]

추창엽, 이정석, and 백종배. 2019. The Thermal Stability Analysis of Fumes and Mists During the Drying Process of a PCB. Journal of the Korean Society of Safety, 34, 4, (2019), 32-40. DOI: 10.14346/JKOSOS.2019.34.4.32.