Manufacturing and Characterization of PI/MgO Composite Films with High Heat Resistance and Heat Dissipation Properties 


Vol. 62,  No. 6, pp. 353-364, Dec.  2025
10.12772/TSE.2025.62.353


PDF Full-Text
  Abstract

Polyimide (PI), a high heat-resistant polymer, was reinforced with thermally conductive magnesium oxide (MgO) fillers to fabricate composite films with enhanced thermal stability and heat dissipation properties. Polyamic acid (PAA) solutions blended with varying MgO contents were thermally imidized, confirming complete conversion of PAA to PI in all cases. Morphological analysis indicated that increasing MgO content led to higher filler particle density on the film surface, with partial sedimentation observed due to density differences. Thermal analysis showed that all composites exhibited glass transition temperatures above 380°C and decomposition temperatures above 500 °C. Thermal conductivity increased significantly with MgO addition, rising from 0.272W/m·K for pure PI to 0.423W/m·K at 10 wt%, with a steep increase observed beyond 8wt% due to the formation of effective heat transfer pathways. In contrast, mechanical properties declined with increasing MgO loading, as tensile strength decreased from 10.95MPa for pure PI to 4.20MPa at 10wt%, accompanied by reduced elongation at break. These results demonstrate the potential of PI/MgO composites as heat-resistant materials with tunable thermal conductivity, albeit with compromised mechanical performance at higher filler contents.

  Statistics
Cumulative Counts from November, 2022
Multiple requests among the same browser session are counted as one view. If you mouse over a chart, the values of data points will be shown.


  Cite this article

[IEEE Style]

백지연, 이상오, 김경효, 이재웅, "Manufacturing and Characterization of PI/MgO Composite Films with High Heat Resistance and Heat Dissipation Properties," Textile Science and Engineering, vol. 62, no. 6, pp. 353-364, 2025. DOI: 10.12772/TSE.2025.62.353.

[ACM Style]

백지연, 이상오, 김경효, and 이재웅. 2025. Manufacturing and Characterization of PI/MgO Composite Films with High Heat Resistance and Heat Dissipation Properties. Textile Science and Engineering, 62, 6, (2025), 353-364. DOI: 10.12772/TSE.2025.62.353.

Search
(IN TITLE, AUTHOR, ABSTRACT,KEYWORDS)

Advanced Search ▼

POPULAR KEYWORDS
(TOP 10 KEYWORDS)

Recent Publications
(LAST 3 YEARS)

pISSN : 1225 - 1089
eISSN : 2288 - 6419

한국연구재단 우수등재학술지 유지 (2022년)