A Study on the Electromagnetic Interference Shielding of Carbon Nanotube/Copper Composite Fabricated via Electroplating 


Vol. 57,  No. 4, pp. 239-246, Aug.  2020
10.12772/TSE.2020.57.239


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  Abstract

With the development of wireless technology, it has become necessary to protect information technology devices from electromagnetic interference with electromagnetic- shielding materials. In this study, an electromagnetic-shielding material was prepared using a carbon nanotube (CNT) sheet electroplated with copper. The copper electroplating on the CNT sheet improved the electrical conductivity of the CNT sheet, which increased the overall shielding effectiveness (SE). The SE was evaluated using a vector network analyzer. The measured SE of the raw CNT sheet was 37.84 dB, and the SE of the composite sheet electroplated with copper increased to 83.9 dB, which was comparable to that of pure copper. Additionally, the composite sheet showed a high SE per unit thickness of 5412.72 dB/mm. Therefore, this study serves a reference for the improved development of thin light materials via copper electroplating on CNT sheets for electromagnetic-interference shielding.

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