Cure Behavior, Thermal and Mechanical Properties of Epoxy Resins with Arene Substitution Patterns of Phenylenediamines 


Vol. 61,  No. 2, pp. 70-80, Apr.  2024
10.12772/TSE.2024.61.070


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  Abstract

To study the effect of arene substitution patterns of phenylenediamines, as curing agents, on curing behaviors, thermal and mechanical properties of epoxy resins, DGEBF(Diglycidyl ether of bisphenol F) and o, m, p-phenylenediamine(PDA) were selected. The cure kinetics of epoxy mixtures were analyzed under both dynamic and isothermal conditions using differential scanning calorimetry(DSC). The activation energy and curing initiation temperature were found to be lowest with p-PDA and highest with o-PDA and it resulted that the degree of cure and curing rate were highest and fastest with p-PDA and lowest with o-PDA. Tg and thermal stability of the epoxy samples were better with o-PDA and m-PDA than p-PDA. Tensile strength and fracture toughness were highest with m-PDA and lowest with p-PDA. These results indicated that m-PDA could be the best curing agent of isomeric PDAs. And mechanical properties of the epoxy resin could be different only by the isomeric structures of curing agents.

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  Cite this article

[IEEE Style]

박건환, 권웅, 천지연, 정희제, 임지훈, 원종성, 이만영, 이승걸, 정의경, "Cure Behavior, Thermal and Mechanical Properties of Epoxy Resins with Arene Substitution Patterns of Phenylenediamines," Textile Science and Engineering, vol. 61, no. 2, pp. 70-80, 2024. DOI: 10.12772/TSE.2024.61.070.

[ACM Style]

박건환, 권웅, 천지연, 정희제, 임지훈, 원종성, 이만영, 이승걸, and 정의경. 2024. Cure Behavior, Thermal and Mechanical Properties of Epoxy Resins with Arene Substitution Patterns of Phenylenediamines. Textile Science and Engineering, 61, 2, (2024), 70-80. DOI: 10.12772/TSE.2024.61.070.

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pISSN : 1225 - 1089
eISSN : 2288 - 6419

한국연구재단 우수등재학술지 유지 (2022년)