Manufacturing and Characterization of TGDDM Epoxy-based Carbon Fiber Composites for Space Applications According to Curing Agent Types 


Vol. 61,  No. 3, pp. 99-109, Jun.  2024
10.12772/TSE.2024.61.099


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  Abstract

In this study, the characteristics of TGDDM (N,N,N’,N’-tetraglycidyl-4,4’-diaminediphenylmethane) based epoxy resin for space applications were analyzed, and carbon/epoxy composites were fabricated using this resin as the matrix. M-MIPA (4,4’-methylenebis(2-isopropyl-6-methylaniline)) and M-DEA (4,4’-methylenebis(2,6-diethylaniline)) were used as base curing agents. Additionally, 3,3’-DDS (diaminodiphenyl sulfone) and 4,4’-DDS were respectively added to formulate the two types of epoxy matrices. The addition of 4,4’-DDS led to a lower initiation temperature and increased heat of reaction compared to 3,3’-DDS. However, the maximum exothermic temperature and activation energy showed no significant difference. Moreover, the addition of 4,4’-DDS increased the glass transition temperature, crosslink density, tensile strength, and strain at break of the epoxy. The thermal decomposition behavior of the cured epoxy indicated that with the addition of 4,4’-DDS, the activation energy was higher in the early stages of decomposition compared to 3,3’-DDS. However, it aintained a thermally stable region with negligible change in activation energy even as conversion increased. The flexural strength of the carbon/epoxy composites with 4,4’-DDS was 8.15% higher than that of the composites with 3,3’-DDS.

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  Cite this article

[IEEE Style]

이지은, "Manufacturing and Characterization of TGDDM Epoxy-based Carbon Fiber Composites for Space Applications According to Curing Agent Types," Textile Science and Engineering, vol. 61, no. 3, pp. 99-109, 2024. DOI: 10.12772/TSE.2024.61.099.

[ACM Style]

이지은. 2024. Manufacturing and Characterization of TGDDM Epoxy-based Carbon Fiber Composites for Space Applications According to Curing Agent Types. Textile Science and Engineering, 61, 3, (2024), 99-109. DOI: 10.12772/TSE.2024.61.099.

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pISSN : 1225 - 1089
eISSN : 2288 - 6419

한국연구재단 우수등재학술지 유지 (2022년)