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Preparation and Characteristics of Embroidered Circuit Board Using Conductive Yarns for e-Textile Applications
Cheon Hee Jeong Hyun Ju Park Seon Gyeong Kang Ah Rong Kim Jong S. Park
Vol. 58, No. 6, pp. 290-297, Dec. 2021
10.12772/TSE.2021.58.290
Vol. 58, No. 6, pp. 290-297, Dec. 2021
10.12772/TSE.2021.58.290
Evaluation of Installation Damage According to Simulated Installation Test Conditions and Creep Deformation of Geosynthetic Reinforcements
Bu Yeol Choi Sang Min Han Seung Ho Lee Seung Hyun Kim Han-Yong Jeon
Vol. 58, No. 4, pp. 207-213, Aug. 2021
10.12772/TSE.2021.58.207
Vol. 58, No. 4, pp. 207-213, Aug. 2021
10.12772/TSE.2021.58.207
Effect of Bonding Temperature on the Adhesion Characteristics and Mechanical Properties of Non-woven LMPET/PET
Sejin Choi Ji Hwan Lim Han Seong Kim
Vol. 55, No. 2, pp. 112-117, Apr. 2018
10.12772/TSE.2018.55.112
Vol. 55, No. 2, pp. 112-117, Apr. 2018
10.12772/TSE.2018.55.112